This animation shows some of the assembly steps involved in the manufacturing of a tunable laser module based on photonic integrated circuits. As a world leading photonics packaging foundry, PHIX is scaling up the production volumes of devices like these on (semi-) automatic equipment.
An important step is the edge coupling (hybrid integration) of an indium phosphide (InP) gain chip to a silicon nitride (SiN) main chip using active alignment. Connecting this subassembly to the outside world involves fiber array attachment and wire bonding. The assembly is housed in a hermetically sealed butterfly package in which temperature is regulated using a thermoelectric cooler (TEC) and a thermistor.
Ultra-narrow linewidth tunable external cavity lasers such as this module find use in LiDAR, coherent communications, and industrial (fiber) sensing applications.
Негізгі бет Animation of the assembly of a hybrid tunable laser
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