It’s challenging enough to deal with wireless signals at the 5G and 6G frequencies. But with increased density in chips crammed into smaller packages, higher power, beam forming, and MIMO, design requirements are very different than in the past. Simple parasitic extraction no longer is sufficient. Daren McClearnon, product manager for RF and microwave simulation at Keysight, talks with Semiconductor Engineering about the need for new technology and approaches, including co-design, to handle thermal effects and electromigration, as well as a host of secondary effects.
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