If you want to konw more, contact our engineer:
【Minder Hu】
WeChat/Whatsup: 15813334038
Email:
minder@minder-hightech.com
shunyu.hu@163.com
Негізгі бет Die bonder / Die bonding machine for IC/TO Package Semiconductor industry
If you want to konw more, contact our engineer:
【Minder Hu】
WeChat/Whatsup: 15813334038
Email:
minder@minder-hightech.com
shunyu.hu@163.com
Пікірлер