1. TSMC SoIC?
2. Process
: Step 1. CMP (Chemical Mechanical Polishing)
: Step 2. Surface Activation by plasma
: Step 3. Chip to Chip Bonding for dielectric material bonding at room temperature
: Step 4. Anealing for Cu to Cu metal bonding at high temperature
: Key machine suppliers - EVG, SUSS MicroTec, ASM Pacific, Besi, and Applied Materials
3. Applications
: Sony Image Sensor
: AMD 3D V-Cache
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