The solder paste printing process is rightly considered to be the most demanding step in SMT production. Stencils, paste, squeegees and tooling are indispensable. What at first seemed very craftsman-like has become state-of-the-art technology for maximum speed and production volumes in modern SMT production. And although large quantities of PCBs are often produced at very high speeds, the process must comply with the highest precision requirements - despite the fact that it is confronted with a number of difficulties: the components and PCBs can have different dimensions, tolerances and surface properties while the handling of solder pastes, cleaning materials such as fabrics and solvents poses additional challenges in terms of both automation and environmental compatibility.
In this edition of Facts on Open Automation, Laszlo Sereny and his studio guests will shed light on how this critical and complex production process can be flexibly supported by intelligent automation options with a multitude of custom-tailored tools and solutions, and how quality and environmental awareness can go hand in hand with a sustainable approach to manufacturing.
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☑️ TIMESTAMPS
00:00 Introduction
01:13 Challenges in the printing process
04:59 Board Support
07:49 Printed Circuit Board
10:42 Stencils
12:02 Squeegees
16:52 Paste
23:40 DEK TQ printer platform
29:28 Summary
Негізгі бет Ғылым және технология Facts on Open Automation | Advanced printing flexibility
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