Session 8, Hot Chips 2023, Tuesday, August 29, 2023.
AMD Next Generation FPGA Built From Chiplets
Dinesh Gaitonde, AMD
Intel’s Agilex-9 Direct RF FPGAs with Integrated 64 GSPS Data Converters
Benjamin Esposito, Intel
High Performance Cold Plates for Data Center Thermal Management via Electrochemical Additive Manufacturing (ECAM)
Ian Winfield, Fabric8Labs
Негізгі бет HC2023-S8: FPGAs & Cooling
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