The latest Viscom XM sensor technology inspects the solder paste with highest precision and speed. An orthogonal camera, four angled views and the outstanding height tracking up to 4 mm guarantee shadow-free inspection and reliable fault detection, including sinter paste or glue dots. Easy operation as well as efficient program creation round off the first-class system concept. Evaluating the 3D measurement data and linking the results with the paste printer, placement system, AOI and AXI allows for effective process control and sustainable quality improvement.
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Highest Quality from the Start: S3088 ultra chrome 3D Solder Paste Inspection
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