Adam has started to get really good at interviewing people. Like looking at this interview versus some of his earlier interviews. This is really great!
@ZenStrive52
11 ай бұрын
He has been slowly eating Gordon...
@3Dant
11 ай бұрын
@@ZenStrive52 Next thing you know he's gonna start saying "all that goodness" and talking about how SFF PCs suck
@__aceofspades
11 ай бұрын
Packaging is the future of CPUs and GPUs. There is only so much you can do with node shrinks and how fast you can transition to compelling nodes. Look at how TSMC has now stumbled with 3nm, it was delayed and now we see the A17 pro with it, and its a disappointing node. Packaging doesnt solve node issues, but it allows far more flexibility, cost savings, specialization, etc. Intel has done a great job in positioning themself for the future.
@deadman5985
11 ай бұрын
The biggest challenge now is the energy invested for cross-chiplet/tile communication. This is make or break. Real innovation happening behind closed doors, here's hoping that Intel can still innovate.
@nekogami87
11 ай бұрын
How do you know the A17 pro sucks because of the node and not because of chip design exactly ?
@zuckdaddy1596
11 ай бұрын
@@nekogami87it does in part suck because of the node, but the node Apple is using isn't "real" TSMC N3. it's best thought of as an N3 beta. Apple pays ludicrous amounts of money to get the best node before anyone else, and usually it's not as good as the standard node that other companies get access to
@nekogami87
11 ай бұрын
@@zuckdaddy1596 yeah but that's business as usual, we know that apple basically paid for the previous 3 nodes or so what they had might not be the best N3 but if they consider the perfs of A17 as bad, it's more because of the design choice rather than the node imo ?
@zuckdaddy1596
11 ай бұрын
@@nekogami87 N3 in particular had some issues, that’s why the standard N3 node was delayed. Apple’s secret sauce node is just a little subpar relative to what they usually get. it may well also be a design issue in part. their new mac SOC doesn’t seem that much more performant either. but personally I’d place my bets at least for the mobile silicon on funky N3 not panning out too well
@unclerubo
11 ай бұрын
I wish I could feel excited about anything as much as Wendell is about new tech :')
@deadman5985
11 ай бұрын
I'm not an analyst but merely a consumer and I think it's a good step forward. At this point everyone's gotta be excited that they're able to do that since Intel's recent history concerning their ability to innovate is kinda...I don't wanna say disappointing but in the end I guess that's what it has been recently... A market leader of the past, just gotta hope they can be again in the future. Until then, prepare for cheaper CPUs for us consumers - which is exciting :) Always cheer for the Underdog for the sake of healthy competition!
@hammerheadcorvette4
11 ай бұрын
Our receptors are fried with so much dopamine spikes throughout the day. The best way to ge tthose sensations back is by letting go for a while. @@costafilh0
@TokenTech
11 ай бұрын
Wendell is like a kid on Christmas morning! I love it! I have no idea what he is talking about but damn it sounds cool!
@FrenziedManbeast
11 ай бұрын
Wendell operates several tiers above many people and it comes through so well on KZitem. He's got the long-game view for silicon to understand implications for the industry from these press releases where I'll be glazed over wondering how this could ever benefit me. I've been watching his stuff off and on for years and he's right more often than wrong. He's part journalist, part nuclear physicist!
@DeltaSierra426
10 ай бұрын
Intel's new packaging is one of the few things they have going for them. Also interesting that packaging and tiles is how they want to be known for breaking into what has historically been called chiplets. It makes sense in that every brand tries to forge it's own identity and marketing approach. Ultimately though, how successful it is will depends on Intel's execution, not marketing and academics. As Wendell said, it it's a bit tricky to ensure everything works well together and performance continues to scale, i.e. it's not just a given.
@Mervinion
10 ай бұрын
Intel is supposedly investing in packaging facility in Poland. People are thinking that it would be just putting products fabricated in Germany into boxes. I try to explain them that "Packaging" means something more when dealing with silicon. Packaging facilities can be as much advanced as fabrication and are more important than ever.
@flech3025
11 ай бұрын
Wendell!
@matthewsmith3817
11 ай бұрын
The real question is what powers Wendell's teleportation device? Or does he have clones?
@z330
11 ай бұрын
Wendell on the big screen crazy
@TheFlyingCrocodile
11 ай бұрын
we love wendell
@vargonian
11 ай бұрын
Wendell is such a good human being. I had a button on a Level1 KVM break when a cleaning service was too rough on it, and he 3D printed a replacement and sent it to me for free.
@nal_er
11 ай бұрын
Wendel is #1!
@costafilh0
11 ай бұрын
BIG packages are definitely the future!
@jjdizz1l
10 ай бұрын
I love new upcoming technology.
@Matt-oq4jq
11 ай бұрын
WENDELL
@divyjotsingh3879
11 ай бұрын
I have never thought way about interposers. They're added cost to save costs. I'm dum and wendells a genius
@RayanMADAO
11 ай бұрын
Cxl sounds really interesting, almost revolutionizes modern computer architecture
@doxydoxdelamanca9902
11 ай бұрын
The expanse offered insight into the future = all-glass phones.
@NoName-bg2om
11 ай бұрын
Mix of glass and titanium, lol
@zodwraith5745
11 ай бұрын
Holy shit I never realized how tall Adam is. I know Wendell is a big boy but damn I never thought APM would be even taller. Friend of the show wants to know how tall are you really Adam? Does the mere sight of you make Asians run in fear?
@3Dant
11 ай бұрын
Yeah but what's APM's APM?
@pcworld
10 ай бұрын
6'2", and it strikes fear in me when I need to make a thumbnail :P -Adam
@pcworld
10 ай бұрын
Was never a pro Starcraft player so it's gotta be low! -Adam
@EinSwitzer
11 ай бұрын
Products that makes it intact to the purchaser as well as looking cool on a shelf or In backdrop.
@lightward9487
10 ай бұрын
Please put subtitles in your videos!
@trashtalketernal
11 ай бұрын
packaging is reality
@mikebruzzone9570
11 ай бұрын
I've been covering this since Intel wanted to start selling TSMC package services in Arizona 2 years ago where have you been Adam and Wendell? mb
@mikebruzzone9570
11 ай бұрын
Wendell, a hundred different versions of a Xeon, haha. I do have the exact count of merchant open market and some of the custom SKUs. mb
@tomstech4390
11 ай бұрын
5:30 a bit like AMD resuing IO dies with newer generations of Ryzen (3000-5000, and 7000-) Intels looking at all the benefits and posibilities AMD has been doing for the last few years.
@scarlet1221
10 ай бұрын
'Developers. Developers. Developers' Woohoo!
@tomstech4390
11 ай бұрын
It's so entertaining hearing people excited about AMD's previous technologies. "OMG they can mix different generations of chiplets and IO dies" "the cost to produce each chiplet is reduced" "they can bin just the cores for server and the higher power draw dies to go desktop, they don't have to bin a whole monolithic chip" It's like watching a Adored video from 2018, You wait Intel will make GPU's and 3D vcache chips next ;)
@LemmingOverlord
11 ай бұрын
Intel's been banging on about packaging and interconnects for God knows how long. They just kept missing targets or failing to secure customers. They were also their own worst customer...
@ZenStrive52
11 ай бұрын
Wendell is huge but Adam is huger 😵
@fredsorre6605
11 ай бұрын
It's funny how things changed in just a few years oh how Intels comments that AMD's gluing their chips together didn't age well especially now that they are gonna be using a similar type of technology for their future processors .
@entium1
11 ай бұрын
Intel vs AMD approach are quite different, AMD's approach ends up with far more latency, hence why they dropped the amount of chips they are placing together. But of course there are pros and cons to each approach. And Intel actually had their tech about one generation after AMD had there's just that, with the fab issues Intel was having that slowed down their ability to bring it to market at the same.
@fredsorre6605
11 ай бұрын
@@entium1 it still doesn't change the facts that they said what they said even though they were building towards the same technology by the end of it all we can argue about semantics and how much better Intel's approach is compared to AMD when that all that matters here is that Intel said those things in a desperate attempt t o downplay AMD's achievement.
@claucmgpcstuf5103
11 ай бұрын
Wel yea. It is all Veri cool but I hope Intel Daz on tha ultra cpu only p core an big ones and hipertreding.. for tha sek of tha name ey . !!
@kingofstrike1234
11 ай бұрын
did he just avoided the question on glass can break ?
@frankkratosvlogs3469
11 ай бұрын
Interesting 🤓
@ArndBrugman
11 ай бұрын
Network Attached Memory. NAM.
@MarcosBurg
11 ай бұрын
I'm waiting for a CPU with a bad-ass discrete GPU
@shadow7037932
11 ай бұрын
Won't happen any time soon.
@mika2666
11 ай бұрын
Depending on your definition of bad-ass the AMD Strix Halo leaks are looking pretty good
@NoName-bg2om
11 ай бұрын
Maybe making a GPU with integrated CPU would be better for gaming related things
@Veptis
11 ай бұрын
So, smaller dies to improve yields. Crazy packaging to reduce yield?? As for it being about developers? I was hoping for a few things that didn't get to me via keynotes, pre show, post show or even outside coverage. All I hear is "HybridAI" and using Intel DevCloud. I want a workstation accelerator card, not Xeons and DDR5
@heickelrrx
11 ай бұрын
In 2021 intel radically changed their cpu core paradigm with 2 type of cores In 2023 intel radically chages their interconnected again Things radically changes these days
@Zalionn
10 ай бұрын
Serious question. Are they twins?
@JamesSmith-sw3nk
11 ай бұрын
Adam, how tall are you?
@pcworld
11 ай бұрын
6' 2" -Adam
@rhoharane
10 ай бұрын
lmao adam's still using that intro from LTX
@pcworld
10 ай бұрын
I really need to ditch it :P -Adam
@lightward9487
10 ай бұрын
@@pcworld Please put subtitles in your videos!
@jamesbowen6144
11 ай бұрын
I am just a truck driver , Intel where would you like this load of gorilla glue ,,, lol ...ha ha
@jeremimiller4438
11 ай бұрын
I new Intel would have to go chiplet to stay competitive.
@jeremimiller4438
11 ай бұрын
😏
@entium1
11 ай бұрын
they have been using chiplet designs for many years now
@rozzbourn3653
11 ай бұрын
intel was using "chiplets" since the pentium d in 2005. thats when AMD said "intels cpu is just 2 dies glued together".
@JigilJigil
11 ай бұрын
IMO, Intel has a plan to switch everything around, from being a TSMC customer, to making TSMC (and Samsung) its own customers, if we trust what Gelsinger says, (everything is on schedule) Intel is on the path becoming the semiconductor leader again with 20a and 18a process nodes, and then with gaining monopoly on glass packaging, TSMC and Samsung won't have a choice but to be the customers of Intel (assuming that Intel is going to provide them packging services), they won't have a choice but to fabricate their customers chips in house and send them to Intel for the packaging. (the other choice would be to develop their own glass substrate technologies which would take them 10-20 years, in the best case scenario).
@nekogami87
11 ай бұрын
More likely that either their patent on the glass substrate is not enforceable (for any reasons like from "it was patented before" to "others have actually a different manufacturing process") or there is gonna be a cross licensing happening. Also, you assume none of the others have started working on this. pretty sure samsung had something about glass substrate already.
@Mr.Morden
11 ай бұрын
I wanna see Intel's fancy new glass substrate. Why? RGB baby!
@kingkrrrraaaaaaaaaaaaaaaaa4527
11 ай бұрын
I'm pretty sure Ian from TechTechPotato mentioned it wont be see through. At least that is what he mentioned from his latest video.
@Mr.Morden
11 ай бұрын
@@kingkrrrraaaaaaaaaaaaaaaaa4527 I've seen some samples on display and they are definitely transparent, though some are also more like frosted glass.
@blackmennewstyle
11 ай бұрын
They were making fun at AMD for gluing chips andd look at them now lol AMD: You could not live with your failure, where did that bring you? BACK TO ME 🔥🚀
@honestcomputing
11 ай бұрын
The implementation of it is very different. AMD uses the substrate to connect chiplets together. Intel will use active silicon (foveros) to connect all the chiplets together. Much greater efficiency in doing that because the chiplets won't waste a lot of power when they're trying to communicate with other chiplets.
@mikeb3172
11 ай бұрын
Engineering & worshipping commentary by grateful butlers...
@Deltium5683
11 ай бұрын
Instead of kid Adam, can you please have someone credible on these interviews? Adam is simply not qualified.
@deadman5985
11 ай бұрын
For the sake of competition I really wished Intel had some "real" secret sauce. Just seems like some "glued together" stuff, of which they accused their competition years ago. While the glue is different, let's not pretend they are years behind at this point 🫣
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