Drilling of many deep holes in thick silicon substrates can be done efficiently using Avonisys high-power IR waterjet laser systems.
In this video we drill a matrix of 100 holes of 1mm in diameter and 8mm deep, while each hole takes approx. 60s to drill.
Unlike conventional mechanical drilling and ultrasonic processes, there is no tool wear and no tool breakage risk.
Additionally the waterjet laser system can also make non-round holes such as ellipses, rectangles and squares.
Негізгі бет Ғылым және технология Laser hole drilling in thick silicon / Laserbohren von dickem Silizium
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