In this comprehensive video series, we delve into the intricate details of Electromigration Analysis, a critical aspect of modern Analog and Digital VLSI designs. Electromigration, a phenomenon rooted in the physics of material transport, involves the gradual movement of ions within a conductor due to momentum transfer between conducting electrons and diffusing metal atoms. This analysis is typically conducted once the layout (GDSII) of a design is generated, allowing for the prediction and correction of potential circuit longevity issues. If left undetected, Electromigration can lead to performance degradation and eventual chip failure over time. Throughout the series, we focus on various factors influencing Electromigration, such as temperature, voltage, and frequency, exploring their effects on the phenomenon in detail. Topics covered include the basics of Electromigration, the physics behind it, failure prediction methodologies, detection techniques, and mitigation methods. Additionally, we delve into related concepts like IR-Drop and Ground Bounce, discussing their significance, analysis techniques, and mitigation strategies within the context of VLSI design. Through a structured approach and insightful discussions, this series equips viewers with a thorough understanding of these critical aspects, empowering them to address potential challenges effectively in their VLSI designs.
In this video the below topics are covered :
00:00:00 Intro to the marathon episode on EM & IR
00:00:35 Intro - What is Electromigration(EM) ? Physics of Electromigration
00:01:47 Pictorial Example of Damage caused by Electromigration(EM)
00:02:24 Physics of EM failure prediction
00:03:26 How EM damages Metal or Via ?
00:04:44 Methods of EM-Detection
00:05:17 EM analysis of a design in VLSI
00:06:55 EM in Analog Full/Semi Custom designs & fundamentals
00:10:14 EM in Digtal SOC/ASIC designs & fundamentals
00:12:49 EM Detection Methodology Fundamentals
00:14:01 Special Parasitic Extraction (PEX) & Format-Specification (SPEF/DSPF) for EM Detection Flow
00:16:16 EM Failure Mitigation Methods
00:17:23 Effect Temperature on EM : Intro
00:17:59 Viewer's Question
00:18:29 Chapter Index
00:19:09 Introduction
00:23:28 Revisit Black's Equation
00:25:38 Black’ Equation Interpretation in EM/VLSI
00:27:21 Temperature Vs MTF : A Graphical Tour
00:29:22 Temperatures : Co-Exist Inside Chip
00:31:50 Heating Effects Inside The Chip
00:34:09 Summary
00:35:37 Effect Voltage & Frequency on EM : Intro
00:36:16 Viewer's Question
00:36:54 Chapter Index
00:37:57 Electromigration (EM) and Voltage : Introduction
00:41:29 Impact of Voltage on EM : In Detail
00:44:55 Mitigation
00:45:42 What is Stress ?
00:46:27 Electromigration(EM) and Frequency : Introduction
00:47:52 Effect of Uni-Polar Pulsed DC Waveform
00:49:59 Effect of Bipolar AC Wave Form
00:55:35 Conclusion
00:56:35 Begining & Intro IR-DROP-Episode
00:57:01 Chapter Index
00:58:00 Introduction on IR Drop
00:58:54 Power Delivery Network : Significance on Ir Drop
01:00:53 IR Drop and Ground Bounce : Definition
01:02:10 IR-Drop in IP/Analog & ASIC Design Flow
01:04:33 Resistance of Metal Strip & KCL/KVL
01:06:12 Simple Circuit Diagram & Parasitics
01:07:20 IR Drop Classification : Static & Dynamic
01:07:41 Static IR Drop Analysis
01:11:08 Dynamic IR Drop Analysis
01:14:41 IR Drop & Its Impact Timing Analysis
01:16:30 IR Drop with Multiple Power Domains
01:18:30 Thermal Hot Spot by IR Drop Analysis
01:21:02 IR Drop Mitigation
01:23:12 Summary
01:24:39 Beginning & Intro Ground-Bounce Episode
01:24:58 Chapter Index
01:25:34 Introduction
01:30:29 Correlation of Power/Ground Bounce
01:32:47 Ground Bounce Mitigation Techniques
01:34:07 Power Gating Technique
References & Courtesy :
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dropzone.tamu.edu/~wshi/689/dspf.ps
vlsi.pro/reading-spef-files
imechanica.org
Sound by : KZitem Music & Bensound.com
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