Possibly, ultrasonic shear can help shorten the anneal cycle by concentrating energy at the bond interface. Observing the ultrasonic reflections and transmissions can simultaneously verify bond quality.
@avala457
10 ай бұрын
how long is the anneal cycle and what is the heatsource?
@ruiz.9751
Жыл бұрын
👍
@takiyaazrin7562
Жыл бұрын
Arey Bhaiya All Is Well
@wr81cn
Жыл бұрын
Any update of Hybrid Bonding “2”?
@a24812481
Жыл бұрын
What is dicing purpose for placement accuracy?
@azamat_bezhanov
4 ай бұрын
What can you say about durability, long lifespan of Power management IC units in Chiplet
@azamat_bezhanov
4 ай бұрын
When will we get 2nm with chiplet packaging
@azamat_bezhanov
4 ай бұрын
When will we get 2nm with chiplet packaging
@gokulg6833
4 ай бұрын
Is it possible to get the slide deck?
@jdrevenge
Жыл бұрын
Good presentation/review, but there seems to be a lack of clear credit given to the source material. There is a citations slide, but no indications of which information comes from which reference; also, a very large portion of the material came directly from the Intel presentation on the subject, Elsherbini et al "Enabling Hybrid Bonding on Intel Process", and this reference got a simple KZitem link with no further details. Regardless, thanks for sharing, it was a good introduction.
@azamat_bezhanov
4 ай бұрын
What can you say about durability, long lifespan of Power management IC units in Chiplet
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