In this short video clip, you can clearly see reflow temperature zones. Once the temperature reaches the correct point, the flux activation process will start. Usually, this process happens during the pre-heating zone. After reaching the solder melting point suddenly SMD components start to reflow. During this time most of the solder balls combine into a liquid form of solder. Due to the surface tension of the liquid solder, most of the SMD components will be self-align. If you do not apply the correct amount of solder paste or if you apply too much solder paste, sometimes you may have to align SMD components manually during this reflow process. After all, SMD components reflow correctly, and PCB needs to cool down until the liquid solder fully solidifies.
Негізгі бет Reflow SMD Components With Hot Plate
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