In this short video, you will see how to use low-melt alloy solder to remove larger chips without damaging to pins or PCB pads. Here I am going to use low-melt alloy solder which melts around 58°C according to its datasheet. The brand I am using is “Chip Quick”. This alloy solder is coming as a solid wire. This alloy is very brittle. First, you need to apply the flux that comes with the alloy solder. However, you may be able to use other flux as well. Once you apply flux around your desoldering component, using solder iron apply low melt solder. I heat my soldering iron up to 120°C. This alloy is slightly difficult to apply to standard solder. Once it melts become a gel-like substance. Once I cover it with low melt alloy solder resoldering chip, I let it cool down and use a hot air station to remelt. This will allow the alloy to combine with standard solder with my better. I set my hot air station to an air temperature of 250°C and airflow to 70%. Once you apply low heat to the chip, you will be able to easily remove it from your PCB. Use can use a soldering iron to reheat low-melt alloy solder as well. Once you remove a chip, make sure you properly clean any alloy solder residue left in your PCB. Otherwise, you will get weak solder joints once you resolder your chip.
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