In this webinar, dr. Francesca Bottacchi from Pragmatic introduces Pragmatic’s flexible integrated circuit technology and its advantages over traditional Si technology. This webinar starts with a description of Pragmatic and its manufacturing facilities, including the lower carbon impact and energy requirements, which makes it a more sustainable choice, as well as the advantage of having a fast turnaround.
Pragmatic’s rapid cycle time takes designs from tape-out to delivery in around six weeks, empowering customers to drastically reduce product development time, perform early end-user testing, and accelerate time to market.
We then continue with a quick description of the key technical details. The second-generation Helvellyn 2.1.0 technology node offers four metal layers over a 600 nm minimum channel dimension n-type FET process. The process also includes a dedicated resistor layer and capacitors, it has an
operating voltage of 3 VDC, total thickness of 30 μm, and minimum bending radius of 5 mm.
Particularly suited to applications where form factor and cost outweigh speed and performance criteria, the Helvellyn technology is ideal for applications such as IoT, wearables, AR/VR, RFID, and sensing.
Негізгі бет S9-E1_Pragmatic FlexICs-Part 1-Introduction to Pragmatic's flexible integrated circuits
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