Superb video. Need more of Kind of videos in IC packaging. Your Doing excellent videos. Keep on posting new videos.
@KevinMccable
11 ай бұрын
Thank you very much for your informative about WB sharing. I have learnt a lot from your video part1 part2 hopefully that you will make a fantastic video again and again
@CarlosPereira-t8e
8 ай бұрын
Thanks for sharing!
@rajblueboy514
Жыл бұрын
Excellent Videos, I highly appreciate your time and efforts on this. Thank you.🤝
@watchlearnnplay
Жыл бұрын
Thanks for the feedback.
@wayunoi
Жыл бұрын
This video is very informative. Thanks for doing this.
@watchlearnnplay
Жыл бұрын
My pleasure!
@trailrunning11vlog
Жыл бұрын
Walang sawa sa semicon
@watchlearnnplay
Жыл бұрын
Sabi nga pre, do what you do best hehe
@Than_Thammasila
5 ай бұрын
Thank you so much.
@NikkoMcCarthy
Жыл бұрын
yeah man, keep coming out with content... I cant find pricing for any of this equipment. Maybe that?
@garaba1688
6 ай бұрын
I am still not very clear on how the bond wire is attached to the bond pad and the LF. Could you please provide additional explanation?
@watchlearnnplay
6 ай бұрын
You can get that information in Part 1 video. Thanks for watching.
@viralclip6905
6 ай бұрын
How can I do DOE of Wire bonding process? What is the main key factor?
@watchlearnnplay
6 ай бұрын
Main or key parameters are bond force, power, and time. But DOE for wire bonding is more than just knowing the main parameters. Have fun on your DOE.
@yogeshsharma3029
7 ай бұрын
Wire bonding miss ball problem
@MahmoudAhmed-nq6ze
Жыл бұрын
Hello, Great Video! I am a PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform bonding of 46*46 um pad size with pad pitch of 51 um (distance between pads of 5 um only) of 22nm technology on a 44QCFP package using a diameter wire of 0.5mil and 30um fine pitch capillary. I read the bonding machine manual and followed the steps to teach the machine but I don't know the criteria to specify the bonding parameters. Also, I am currently stuck at the wire threading step through the capillary (It is very hard to thread it through and once I do it and operate the machine it gets cut every time and error message appears). can you help me with this?
@watchlearnnplay
Жыл бұрын
Does the wire gets pulled out from capillary everytime you get an error? And the error is EFO open? And is the error happening when you're trying to form FAB after threading or is it during bonding?
@MahmoudAhmed-nq6ze
Жыл бұрын
@@watchlearnnplay hello, thank you for your reply.. the capillary starts moving to bonding position strongly then the wire gets cut and following error message appears: Motor: Bond head Z search contact level out of range system will auto clear servo error (F110) to recover
@watchlearnnplay
Жыл бұрын
I would think of two possibilities. A really serious problem would be Z servo motor or control board problem but that should be rare especially if your machine is not that old. I suggest to do XYZ servo calibration first. A minor problem would be related to camera to crosshair offset. It is possible that camera offset is not thought properly such that X-Y table would go to the wrong position where bond surface or bond plane is not there or too deep which is causing the bond head error. Usually, if the camera offset is correct this type of error will cause the bond head to crash and break the capillary. Hope this helps.
@MahmoudAhmed-nq6ze
Жыл бұрын
@@watchlearnnplay thank you so much for your help.. I will try and hope it gets solved
@likemeyocurutoo
6 ай бұрын
wire bonding temperature plz
@watchlearnnplay
6 ай бұрын
150C to 240C depending on your device, leadframe / substrate and bonding machine. For room temp bonding you can use Al wedge bonding process
@likemeyocurutoo
6 ай бұрын
@@watchlearnnplay Is the higher the temperature, the better?
@likemeyocurutoo
6 ай бұрын
I have a lot of questions. Please let me know your e-mail
@watchlearnnplay
6 ай бұрын
You can message me thru my linkedin account
@watchlearnnplay
6 ай бұрын
For bonding, higher temp the better. But not all materials are good at high temp.
@nicolasgarapon5023
3 ай бұрын
How about parametric in asm gocu or aero, new subscriber. Thank you sir.
@sarminadirashaikharahim6616
Ай бұрын
hi can you made a video on clip bonding?
@briandong5293
Жыл бұрын
Excellent video I will be getting trained in using the K$S IConn at my workplace. Do you have more videos that go into detail on die attach?
@watchlearnnplay
Жыл бұрын
Die attach video coming out soon. Thanks for the feedback.
@Sokol_
Жыл бұрын
Thank for your time and knowledge!
@jorgebacani1901
Жыл бұрын
hi, can i just ask if you formerly worked @stanford microsystems inc?
@watchlearnnplay
Жыл бұрын
No sir
@hassanhenawi-f2q
Жыл бұрын
Thank you so much for the information, I am working on CoB tech and I mainly use ball bonding with gold wire (25 um) but the pull test is not satisfying. The wire is always cut right above the mashed ball. Do you have a clue where this might come from? loop formation or too much used force
@watchlearnnplay
Жыл бұрын
Cut above mashed ball is also called "break at ball neck" break mode. This break mode is not uncommon. That section of the wire is the HAZ which is the weakest part of the wire. Pull strength can be affected by several factors. Are you getting low pull strength or you're just concerned about the break mode? Note that MIL or JEDEC std do not require specific break mode but rather just pull strength.
@hassanhenawi-f2q
Жыл бұрын
Yes exactly I am getting low pull strength @@watchlearnnplay
@watchlearnnplay
Жыл бұрын
If you can share additional information I can definitely help you on this. You can send it by email. Would be good to see at least a sample photo of the device bonding layout and loop height / profile that you are using.
@ripplehe
6 ай бұрын
Thank you so much for technical details. Clear and sound!
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