An explanation and demo of atomic layer deposition (ALD) of copper metal on glass. Precursors are copper(I) chloride and hydrogen, processed in a hot-wall tube quartz tube furnace.
10 torr operating pressure
500 sccm argon sweep/purge gas constantly flowing
75 sccm CuCl argon pulse gas (17 seconds including flow controller lag)
100 sccm H pulse gas (14 seconds including flow controller lag)
7 second purge time between pulses
100mm quartz tube furnace diameter
415*C deposition temperature
350*C CuCl evaporation temperature
Substrates are mostly borosilicate glass cleaned with RCA clean
The "good" samples shown in the video are about 750 cycles (about 9 hours
Main ref:
sci-hub.se/doi.org/10...
Also helpful:
sci-hub.se/doi.org/10...
sci-hub.se/10.1149/2.0261501jss
sci-hub.se/doi.org/10...
Alicat flow controller manuals (hard to find via website navigation):
documents.alicat.com/manuals/...
documents.alicat.com/manuals/...
documents.alicat.com/Alicat-S...
RCA clean: en.wikipedia.org/wiki/RCA_clean
CuCl synthesis: wwwchem.uwimona.edu.jm/lab_man...
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Негізгі бет Ғылым және технология Atomic Layer Deposition of copper - If you like sputtering, you'll love this!
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