FormFactor’s ReAlign™ technology for the SUMMIT200 wafer probe station enables automated probe-to-pad alignment for applications with limited microscope view such as vertical and Pyramid probe cards.
Measurements can be performed automatically on small pads from -40°C to +125°C with FormFactor’s Pyramid and Takumi probe cards, Celadon High Temperature Cantilever probe cards, and more. Vertical probe cards enable testing of advanced devices for applications such as 5G, the internet of
things and optical sensors.
The ReAlign module is easily removable to support any other available application layer on the SUMMIT200. It can be reinstalled within minutes.
#SUMMIT200 #200mmProbeSystem #ReAlign
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Негізгі бет Automated Wafer Probing with Vertical Probe Cards on the SUMMIT200 Probe Station - FormFactor
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